ShinEtsu X-23-7783-D

Heat dissipation paste with high thermal conductivity is used for recording IC chips, modules, dispersers, etc., high-end electronic products, gray, 4.5W/m.k thermal conductivity, 1kg/ can, common heat dissipation paste. Heat dissipation paste is an oil-like material added with a large amount of metal oxide filler. This composite has high thermal conductivity, low oil permeability and good high temperature stability. It helps to maintain reliable heat dissipation tightness, which will improve heat transfer from electrical/electronic components/radiator/chassis.

Main uses:

1. Transistor

2.CPU heat dissipation

3. Diode rectifier assembly

4. Thermal varistors and various heat dissipation devices requiring effective cooling